CUTTING DEVICE OF FILM, CUTTING METHOD OF RELEASE FILM, CUTTING METHOD OF THE FILM, RESIN SEALING DEVICE OF COMPONENT SEALED WITH RESIN, RESIN SEALING METHOD OF THE COMPONENT SEALED WITH RESIN, AND DEVICE OF MANUFACTURING RESIN SEALED MOLDING

• Main Authors: OWARI HIROKI, TAKADA JUNKO
• Format: Patent
• Language: English; Japanese
• Published: 06.07.2015
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HAND CUTTING TOOLS; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SEVERING; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To provide a film cutting device which can efficiently manufacture a large-size circular release film.SOLUTION: A film cutting device includes a rotation member 3, a rotation arm 7, and a cutter 9. The rotation member 3 and the cutter 9 are respectively connected directly or indirectly to one end of the rotation arm 7 and the other end of the rotation arm 7. The cutter 9 stabs a predetermined position of the film by moving the cutter 9 to a film surface, and passes inside the rotation member 3, and the rotation member 3 rotates around a rotation axis approximately vertical to a film surface. Thereby, the cutter 9 stabbed on the film and the rotation arm 7 rotates to cut the film in a circular shape. 【課題】 大型でかつ円形状の離型フィルムを効率よく製造可能なフィルムの切断装置を提供する。【解決手段】 本発明のフィルムの切断装置は、回転部材３、回転アーム７、及びカッター９を含み、回転アーム７の一端に回転部材３が、回転アーム７の他端にカッター９がそれぞれ直接又は間接的に接続されており、カッター９を前記フィルム面に向かって移動させることにより、カッター９が、前記フィルムの所定位置を突き刺し、回転部材３内部を通り前記フィルム面と略垂直な回転軸を中心として、回転部材３が回転することにより、前記フィルムを突き刺したカッター９及び回転アーム７が回転し、前記フィルムを円形に切り抜くことを特徴とする。【選択図】図１