ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To provide a configuration appropriate for improving heat conductivity right under a sheet member positioned right under a heat radiation surface in an electronic apparatus where the sheet member containing a heat conductive filler and a floating substance in a porous substrate...

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Bibliographic Details
Main Authors NOMURA TORU, SUZUKI TOSHIO, KOJIMA YUJI, KOIKE HARUHISA, NOMURA TAKUMI
Format Patent
LanguageEnglish
Japanese
Published 02.07.2015
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a configuration appropriate for improving heat conductivity right under a sheet member positioned right under a heat radiation surface in an electronic apparatus where the sheet member containing a heat conductive filler and a floating substance in a porous substrate is interposed between the heat radiation surface of an electronic component and a cooling member.SOLUTION: A sheet member 300 is divided into a beneath part 310 whose plane size is larger than that of a heat radiation surface 101 and which is positioned right under the heat radiation surface, and a protrusion part 320 which protrudes from the heat radiation surface 101 and is not in contact with an electronic component 100. The beneath part 310 is pressed down by the electronic component 100 so as to be thinner than the protrusion part 320 and by reducing a density of a floating substance 350 rather than that of the protrusion part 320, a density of a conductive filler 340 is improved. A gap between the beneath part 310 and an interface between the heat radiation surface 101 and a cooling member 200 is filled by the floating substance 350 exuding from a porous substrate 330. 【課題】多孔質基材に熱伝導性フィラーおよび流動物を含有させてなるシート部材を、電子部品の放熱面と冷却部材との間に介在させた電子装置において、放熱面直下に位置するシート部材の直下部における熱伝導性向上に適した構成を実現する。【解決手段】シート部材３００は、放熱面１０１よりも平面サイズが大きく、放熱面直下に位置する直下部３１０と、放熱面１０１よりはみ出して電子部品１００とは非接触状態とされているはみ出し部３２０とに区分される。直下部３１０は、はみ出し部３２０よりも厚さが小さくなるように電子部品１００で押しつぶされて、はみ出し部３２０よりも流動物３５０の密度が低くされることにより、熱伝導性フィラー３４０の密度が高いものとされている。直下部３１０と放熱面１０１および冷却部材２００との界面における隙間が、多孔質基材３３０より染み出した流動物３５０により充填されている。【選択図】図１
Bibliography:Application Number: JP20130265784