POLISHING DEVICE AND POLISHING METHOD

• Main Authors: KUSA HIROAKI, MAEDA KAZUAKI, TAKAHASHI YOSHIMIZU, SEKI MASAYA
• Format: Patent
• Language: English; Japanese
• Published: 25.06.2015
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a polishing device capable of polishing a periphery portion on one side of a substrate.SOLUTION: A substrate device comprises: a substrate holding mechanism 1 which holds and rotates a substrate W such as a wafer; a polishing mechanism 2 which uses a pressure pad 20 to press a polishing tool 10 against a periphery portion of on the upper surface side of the substrate W, thereby polishing the periphery portion; and a periphery portion support mechanism 3 which supports the periphery portion of the substrate W with the use of liquid. The polishing mechanism 2 is arranged on the upper surface side of the substrate W held by the substrate holding mechanism 1. The periphery portion support mechanism 3 is arranged on the lower surface side of the substrate held by the substrate holding mechanism 1. The periphery portion of the substrate W is supported from the lower surface side of the substrate W by the liquid injected from the periphery portion support mechanism 3. 【課題】基板の一方の側の外周部を研磨することができる研磨装置を提供する。【解決手段】本発明の基板装置は、ウエハなどの基板Ｗを保持して回転させる基板保持機構１と、加圧パッド２０によって、研磨具１０を基板Ｗの上面側の外周部に押圧して該外周部を研磨する研磨機構２と、基板Ｗの外周部を液体で支持する外周部支持機構３と、を備える。研磨機構２は、基板保持機構１に保持された基板Ｗの上面側に配置され、外周部支持機構３は、基板保持機構１に保持された基板の下面側に配置され、基板Ｗの外周部は、外周部支持機構３から噴射される液体により、該基板Ｗの下面側から支持されるように構成される。【選択図】図１