IMAGING APPARATUS
PROBLEM TO BE SOLVED: To solve such problems as deterioration of image quality, by making less susceptible to the electromagnetic noise of an imaging device, in a digital camera or a camera built-in portable electronic apparatus.SOLUTION: An imaging apparatus includes a substrate 20 having a first p...
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Main Author | |
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Format | Patent |
Language | English Japanese |
Published |
25.06.2015
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To solve such problems as deterioration of image quality, by making less susceptible to the electromagnetic noise of an imaging device, in a digital camera or a camera built-in portable electronic apparatus.SOLUTION: An imaging apparatus includes a substrate 20 having a first principal surface MS1 and a second principal surface MS2, and an image sensor 10 having an image receiving surface. The substrate 20 is composed partially or entirely of a magnetic material layer, and the image sensor 10 is mounted on the first principal surface MS1 of the substrate 20. For example, the substrate 20 has a nonmagnetic material layer NML1 on the first principal surface MS1, and has a magnetic material layer ML on the side opposite from the image sensor 10 via the nonmagnetic material layer NML1. A wiring pattern 32 connected with the image sensor 10 is formed on the nonmagnetic material layer NML1 of the substrate 20.
【課題】デジタルカメラやカメラ組み込み携帯電子機器における撮像装置の電磁ノイズの影響を受けにくくして、画質の劣化などの問題を解消する。【解決手段】第1主面MS1および第2主面MS2を有する基板20と、受像面を有する撮像素子10と、を有し、基板20は一部または全部が磁性体層で構成されていて、基板20の第1主面MS1に撮像素子10が搭載されている。例えば、基板20は第1主面MS1に非磁性体層NML1を有し、非磁性体層NML1を介して撮像素子10とは反対側に磁性体層MLを有し、基板20の非磁性体層NML1に撮像素子10に接続された配線パターン32が形成されている。【選択図】図3 |
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Bibliography: | Application Number: JP20130263410 |