INSULATION WIRING BOARD AND MOUNTING METHOD THEREOF

• Main Authors: KURITA KATSUMI, TADA KAZUO
• Format: Patent
• Language: English; Japanese
• Published: 25.06.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To make the thickness of solder constant by a simple configuration.SOLUTION: An insulating wiring board 1 integrally includes a dielectric plate 2, a first metal plate 3 fixed to one side of the dielectric plate 2 by brazing, and on which a wiring pattern 5 is formed, and a second metal plate 4 fixed to the other side of the dielectric plate 2 by brazing, and soldered to an external cooling member 6. A protrusion 11 for making constant the thickness u of solder between the cooling member 6 is provided for the second metal plate 4. This protrusion 11 is a bent leg 21 formed by bending the peripheral edge of the second metal plate 4 entirely or partially to the cooling member 6 side. 【課題】簡単な構成で、はんだの厚みを一定化し得るようにする。【解決手段】絶縁板２と、この絶縁板２の一面側にロウ付け固定され、配線パターン５が形成される第一の金属板３と、上記絶縁板２の他面側にロウ付け固定され、外部の冷却部材６に対してはんだ付けされる第二の金属板４と、を一体的に備えた絶縁配線基板１に関する。上記第二の金属板４に対して、上記冷却部材６との間のはんだの厚みｕを一定にするための突起部１１を設けると共に、この突起部１１を、上記第二の金属板４の周縁部の全部または一部を冷却部材６の側へ折り曲げることによって形成される折曲脚部２１とする。【選択図】図１