VERTICAL TRANSISTOR DEVICE STRUCTURE WITH COLUMNAR REGION

PROBLEM TO BE SOLVED: To provide a vertical field effect transistor (FET) device structure that is immune to a high voltage.SOLUTION: A vertical power transistor device includes a semiconductor layer 105 of a first conductivity type and in the semiconductor layer, a plurality of columnar dielectric...

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Main Authors KUOANG ROBERT YANG, GEORGESCU SORIN STEFAN, WAYNE BYRAN GRABOWSKI, ZHU LIN, KAMAL RAJ VARADARAJAN
Format Patent
LanguageEnglish
Japanese
Published 22.06.2015
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Summary:PROBLEM TO BE SOLVED: To provide a vertical field effect transistor (FET) device structure that is immune to a high voltage.SOLUTION: A vertical power transistor device includes a semiconductor layer 105 of a first conductivity type and in the semiconductor layer, a plurality of columnar dielectric regions 130 are disposed. The columnar dielectric region extends downwards from a top face of the semiconductor layer in a vertical direction. Neighboring columnar dielectric regions are separated in a horizontal direction along an axis in a common radial direction by a narrow region having a first width of the semiconductor layer. Each of the dielectric regions includes a columnar conductive field plate member 150 disposed in a center of the dielectric region. The columnar conductive field plate member extends downwards from a top face to the vicinity of a bottom of the dielectric region in the vertical direction. The dielectric region separates the columnar conductive field plate member from the narrow region in the horizontal direction. A source region 120 is disposed on a top face of the semiconductor layer, and a drain region 170 is disposed on the bottom of the semiconductor layer. 【課題】高電圧に耐える縦型電界効果トランジスタ装置構造を提供する。【解決手段】縦型パワートランジスタ装置は、第1の導電型の半導体層105を含み、半導体層に複数の円柱形誘電体領域130が配設される。円柱形誘電体領域は、半導体層の上面から下方に縦方向に延在する。円柱形誘電体領域のうちの隣接しているものは、半導体層の第1の幅をもつ狭い領域により、共通の直径方向の軸に沿って横方向に分離されている。誘電体領域のそれぞれが、その中の中心に配設された円柱形導電性フィールドプレート部材150を有する。円柱形導電性フィールドプレート部材は、上面から下方に誘電体領域の底部付近まで縦方向に延在している。誘電体領域は、円柱形導電性フィールドプレート部材を狭い領域から横方向に分離する。ソース領域120が半導体層の上面に配設され、ドレイン領域170が、半導体層の底部に配設される。【選択図】図1
Bibliography:Application Number: JP20140248620