SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To decrease the possibility of a short circuit between a region having potential on a higher potential side and a region having potential on a lower potential side.SOLUTION: A semiconductor device comprises a first switching element (20), a second switching element (30), a firs...
Saved in:
Main Authors | , , , , , |
---|---|
Format | Patent |
Language | English Japanese |
Published |
22.06.2015
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | PROBLEM TO BE SOLVED: To decrease the possibility of a short circuit between a region having potential on a higher potential side and a region having potential on a lower potential side.SOLUTION: A semiconductor device comprises a first switching element (20), a second switching element (30), a first metal component (50), a second metal component (54), a first terminal (40) having potential on a higher potential side, a second terminal (42) having potential on a lower potential side, a third terminal (44) having midpoint potential and a resin part (66). When assuming that a part to have the same potential with the first terminal is a first potential part (P), a part to have the same potential with the second terminal is a second potential part (N) and a part to have the same potential with the third terminal is a third potential part (O), a first creeping distance between the first potential part and the second potential part is longer than a minimum value of a second creeping distance between the first potential part and the third potential part, and a third creeping distance between the second potential part and the third potential part.
【課題】高電位側の電位を持つ部位と低電位側の電位を持つ部位との間の短絡の可能性を低減すること。【解決手段】半導体装置は、第1スイッチング素子(20)と、第2スイッチング素子(30)と、第1金属部材(50)と、第2金属部材(54)と、高電位側の電位を持つ第1端子(40)と、低電位側の電位を持つ第2端子(42)と、中点電位を持つ第3端子(44)と、樹脂部(66)とを備え、前記第1端子と同電位となる部分を第1電位部(P)、前記第2端子と同電位となる部分を第2電位部(N)、及び、前記第3端子と同電位となる部分を第3電位部(O)としたとき、前記第1電位部と前記第2電位部との間の第1沿面距離は、前記第1電位部と前記第3電位部との間の第2沿面距離、及び、前記第2電位部と前記第3電位部との間の第3沿面距離のうちの最小値よりも長い。【選択図】図6 |
---|---|
Bibliography: | Application Number: JP20130256494 |