PREPREG, AND LAMINATE AND PRINTED CIRCUIT BOARD USING THE SAME

• Main Authors: TSUCHIKAWA SHINJI, KUSHIDA YUKO
• Format: Patent
• Language: English; Japanese
• Published: 22.06.2015
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

PROBLEM TO BE SOLVED: To provide a prepreg that has a high glass transition temperature and excellent low thermal expansion, copper foil adhesiveness, heat resistance and low dielectric characteristic by using Q glass cloth having a high quartz content ratio, and to provide a laminate and printed circuit board using the same.SOLUTION: Provided is a prepreg obtained by impregnating thermosetting resin composition containing: a compatibility-imparted resin (A) obtained by reacting a compound (a) having hydroxyl group and epoxy group in the molecular structure, obtained by etherification-reacting a siloxane resin (a1) having phenolic hydroxyl group at the terminal and a compound (a2) having at least 2 epoxy groups in one molecule, and a compound (b) having at least 2 cyanate groups in one molecule, and having imino-carbonate structure and triazine structure whose reaction conversion of (b) component is 30 to 70 mole%; and a fused silica (B) that is surface treated with trimethoxy amino silane compound, into Q glass cloth and drying the same. 【課題】 石英含有率が高いＱガラスクロスを用いることで、高いガラス転移温度と低熱膨張性、銅箔接着性、耐熱性、低誘電特性に優れたプリプレグ及び、これを用いた積層板、プリント配線板を提供する。【解決手段】 末端にフェノール性水酸基を有するシロキサン樹脂（ａ１）と、１分子中に少なくとも２個のエポキシ基を有する化合物（ａ２）をエーテル化反応させることにより得られる、分子構造中に水酸基とエポキシ基を有する化合物（ａ）と、１分子中に少なくとも２個のシアネート基を有する化合物（ｂ）を、反応させ、（ｂ）成分の反応率が３０〜７０モル％であるイミノカーボネート構造及びトリアジン構造を有する相容化樹脂（Ａ）と、トリメトキシアミノシラン化合物により表面処理された溶融シリカ（Ｂ）を含有する熱硬化性樹脂組成物をＱガラスクロスに含浸、乾燥して得られるプリプレグ。【選択図】 なし