MULTILAYER WIRING BOARD CONNECTION STRUCTURE

• Main Authors: WATANABE MOTOMI, KIKUI KAZUHIKO, OWADA SATORU
• Format: Patent
• Language: English; Japanese
• Published: 18.06.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE; SEMICONDUCTOR DEVICES; WAVEGUIDES

PROBLEM TO BE SOLVED: To shorten the current path length by enabling visual confirmation of a connection state of a master substrate and a slave substrate.SOLUTION: A multilayer wiring board connection structure includes: a master slave 1 which is made of a dielectric substrate and in which a signal conductor pattern 11 is wired on the upper surface; a slave substrate 2 which is made of a multilayer dielectric substrate and in which a signal conductor pattern 21 is wired in the inner layer; and a half-cut BVH24 which is provided from the outer layer on the surface side opposite to the master substrate 1 of the slave substrate 2 and electrically connects the signal conductor patterns 11, 21; and a connection structure 4 which connects the slave substrate 2 with the master slave 1 at the surface opposite thereto. 【課題】親基板及び子基板の接続状態の目視確認を可能とし、かつ、電流経路長を短縮する。【解決手段】誘電体基板からなり、上面に信号導体パターン１１が配線された親基板１と、多層誘電体基板からなり、内層に信号導体パターン２１が配線された子基板２と、子基板２の親基板１との対向面側の外層から内層にかけて設けられ、信号導体パターン１１，２１を電気的に接続する半割りＢＶＨ２４と、親基板１及び子基板２を対向面で接続する接続構造４とを備えた。【選択図】図１