OPTICAL SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SYSTEM, MANUFACTURING CONDITION DETERMINATION DEVICE AND MANUFACTURING MANAGEMENT DEVICE

• Main Authors: MITANI MUNEHISA, KATAYAMA HIROYUKI, ITO HISATAKA
• Format: Patent
• Language: English; Japanese
• Published: 11.06.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide an optical semiconductor device manufacturing method which adjusts a coating layer to have a uniform thickness thereby to achieve excellent luminescent efficiency and reduces the number of processes thereby to improve manufacturing efficiency; and provide a system, a manufacturing condition determination device and a manufacturing management device for determining and managing a manufacturing condition of the optical semiconductor device manufacturing method.SOLUTION: A manufacturing method of an optical semiconductor device 20 comprises: a varnish manufacturing process S1 of manufacturing a varnish 11 which contains particles and a hardening resin; an encapsulation layer manufacturing process S2 of manufacturing an A-stage encapsulation layer 12 from the varnish 11; and an encapsulation process S3 of encapsulating an optical semiconductor element 13 by means of the A-stage encapsulation layer 12. 【課題】被覆層を均一な厚みで調製して、発光効率に優れるとともに、工数を低減して、製造効率を向上させることのできる、光半導体装置の製造方法、その製造条件を決定および管理するシステム、製造条件決定装置ならびに製造管理装置を提供すること。【解決手段】光半導体装置２０の製造方法は、粒子および硬化性樹脂を含むワニス１１を製造するワニス製造工程Ｓ１、ワニス１１からＡステージの封止層１２を製造する封止層製造工程Ｓ２、および、Ａステージの封止層１２によって光半導体素子１３を封止する封止工程Ｓ３を備える。【選択図】図１