ELECTRONIC COMPONENT MOUNTING APPARATUS

• Main Authors: KIDACHI TETSUHIRO, KOSHIO TEPPEI, YAMAUCHI NAOKI, SONODA TOMOYUKI, KINKI KOZO
• Format: Patent
• Language: English; Japanese
• Published: 11.06.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus capable of easily checking dirt within the electronic component mounting apparatus.SOLUTION: The electronic component mounting apparatus 1 is provided with markers 60a-60h each having a mirror surface at plural positions where evaporated auxiliary adhesives are predicted to adhere. When checking adhered objects, a head movement mechanism 9 and an XY table mechanism are driven to position the markers 60a-60h selected as inspection targets so that the markers are in the imaging field of the corresponding first cameras 19-fifth camera 23 respectively. The first camera 19-fifth camera 23 take images of the markers 60a-60h and data of the acquire images are displayed on a display unit. 【課題】電子部品実装装置内において装置内の汚れ具合を容易に確認することができる電子部品実装装置を提供する。【解決手段】気化した接合補助剤が付着すると予測される電子部品実装装置１内の複数の位置に、表面が鏡面状のマーカー６０ａ〜６０ｈを設ける。付着物の確認においては、ヘッド移動機構９、ＸＹテーブル機構を駆動させ、検査対象として選択したマーカー６０ａ〜６０ｈを対応する第１カメラ１９〜第５カメラ２３の撮像視野内に個別に位置合わせする。そして、第１カメラ１９〜第５カメラ２３によって各マーカー６０ａ〜６０ｈを撮像する。取得した撮像データは表示部に表示される。【選択図】図１