AIR CONDITIONING DEVICE

• Main Authors: FUKAGAWA KAZUNARI, KISHIWAKI YUSUKE, OKANO TAKASHI
• Format: Patent
• Language: English; Japanese
• Published: 11.06.2015
• Subjects: AIR-CONDITIONING, AIR-HUMIDIFICATION, VENTILATION, USE OF AIRCURRENTS FOR SCREENING; BLASTING; HEATING; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; LIGHTING; MEASURING; MEASURING QUANTITY OF HEAT; MEASURING TEMPERATURE; MECHANICAL ENGINEERING; PHYSICS; RANGES; TESTING; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR; VENTILATING; WEAPONS

PROBLEM TO BE SOLVED: To perform moisture removal control only when moisture adhesion to an element of a refrigerant thermistor is occurring, in an air conditioning device including a refrigerant circuit and the refrigerant thermistor, which is a thermistor for detecting temperature of a refrigerant in a predetermined portion in the refrigerant circuit.SOLUTION: When a temperature comparison condition, which is a condition in which temperature of a refrigerant and atmospheric temperature become equal, is satisfied, detection temperature of atmospheric thermistors (45, 47) is compared with detection temperature of refrigerant thermistors (43, 44, 46), and moisture adhesion determination is performed. Then, when it is determined that moisture is adhered to elements of the refrigerant thermistors (43, 44, 46), moisture removal control is performed for evaporating and removing the moisture adhered to the elements by self-heating in the refrigerant thermistors (43, 44, 46), by switching a supply voltage to the refrigerant thermistors (43, 44, 46) to a supply voltage for moisture removal higher than a supply voltage for temperature detection. 【課題】冷媒回路と冷媒回路の所定部分における冷媒の温度を検出するサーミスタである冷媒サーミスタとを備えた空気調和装置において、冷媒サーミスタの素子への水分付着が発生している場合にだけ水分除去制御を行うことができるようにする。【解決手段】冷媒の温度と雰囲気温度とが等しくなる条件である温度比較条件を満たす際に、雰囲気サーミスタ（４５、４７）の検出温度と冷媒サーミスタ（４３、４４、４６）の検出温度とを比較して、水分付着判定を行う。そして、冷媒サーミスタ（４３、４４、４６）の素子に水分が付着しているものと判定された場合に、冷媒サーミスタ（４３、４４、４６）への供給電圧を温度検出用供給電圧よりも高い水分除去用供給電圧に切り換えることで、冷媒サーミスタ（４３、４４、４６）における自己発熱で素子に付着している水分を蒸発除去する水分除去制御を行う。【選択図】図５