WAFER INFORMATION PROCESSING DEVICE

• Main Authors: MIYAMOTO REI, KAWAKAMI ATSUSHI
• Format: Patent
• Language: English; Japanese
• Published: 08.06.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To solve a problem that information for correcting a rotation center of a wafer cannot be appropriately acquired.SOLUTION: A wafer information processing device comprises: a synthesis part 102 for synthesizing a plurality of pieces of first distance information each corresponding to a rotation angle different from each other by 90 degrees, of a plurality of pieces of first rotation distance information which includes a rotation angle of a wafer and first distance information relevant to a distance from a rotation center to an edge; a synthesis processing part 103 for acquiring from among a plurality of pieces of synthesized distance information obtained by the synthesis, a plurality of pieces of first distance information before synthesis and the rotation angles corresponding to one and more pieces of the plurality of pieces of synthesized distance information which have less variation in values of serial angles; and a correction information acquisition part 104 for acquiring correction information for aligning the rotation center to the center of the wafer by using the plurality of pieces of first distance information and the rotation angles. Accordingly, information for correcting the rotation center of the wafer can be appropriately acquired. 【課題】ウエハの回転中心を補正するための情報を適切に取得できないという課題があった。【解決手段】ウエハの回転角度と、回転中心からエッジまでの距離に関する第一距離情報とを有する複数の第一回転距離情報の、対応する回転角度が９０度ずつ異なる複数の第一距離情報を合成する合成部１０２と、合成した複数の合成距離情報において、対応する回転角度が連続している値の大きさの変化が小さい複数の合成距離情報の１以上に対応する合成前の複数の第一距離情報と回転角度とを取得する合成処理部１０３と、この複数の第一距離情報と回転角度とを用いて回転中心をウエハの中心に合わせるための補正情報を取得する補正情報取得部１０４とを備えた。これにより、ウエハの回転中心を補正するための情報を適切に取得できる。【選択図】図１