WIRING BOARD AND OPTICAL MODULE

• Main Authors: WATABE ASAMITSU, AIKO YOHEI, MATSUO KAZUHIRO
• Format: Patent
• Language: English; Japanese
• Published: 08.06.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; DEVICES USING STIMULATED EMISSION; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PHYSICS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide: a wiring board 9 capable of reliably performing optical coupling between a photoelectric conversion element and an external optical waveguide; and an optical module.SOLUTION: A wiring board 9 includes an insulating substrate 3 having a mounting region 1a of a photoelectric conversion element. The insulating substrate 3 has a penetration part including at least one through hole 4 penetrating through the insulating substrate 3 from a first main surface 1 to a second main surface 2 in the mounting region 1a. The periphery of an intermediate section of the through hole 4 located at the inside of the insulating substrate 3 is located on an outer side than the periphery of an opening located at the opening of each of the first main surface 1 and the second main surface 2. Thus, such a probability that light in the through hole 4 is prevented from passing therethrough can be effectively reduced. 【課題】 光電変換素子と外部光導波路との光学的結合を確実に行うことができる配線基板９および光モジュールを提供すること。【解決手段】 光電変換素子の実装領域１ａを有する絶縁基板３を含んでおり、絶縁基板３は、実装領域１ａにおいて絶縁基板３を第１主面１から第２主面２にかけて貫通している少なくとも一つの貫通孔４を含む貫通部を有しており、絶縁基板３の内部に位置する貫通孔４の中間部周縁が、第１主面１および第２主面２それぞれの開口部に位置する開口部周縁から外側に位置している配線基板９である。貫通孔４内の光の通過が遮られる可能性を効果的に低減できる。【選択図】 図２