ELECTROLYTIC GOLD PLATING SOLUTION AND GOLD FILM PRODUCED USING THE SAME

• Main Authors: KIYOHARA YOSHIZO, TOMA TSUGUKI
• Format: Patent
• Language: English; Japanese
• Published: 04.06.2015
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

PROBLEM TO BE SOLVED: To provide an electrolytic gold plating solution that can afford higher deposition efficiency than the conventional gold plating solution without causing poor appearance of a gold plated film while favorably retaining mechanical characteristics, wear resistance, electrical characteristics and the like and can reduce the production cost by shortening the time required for gold plating deposition and reducing the concentration of expensive gold contained in the gold plating solution.SOLUTION: The electrolytic gold plating solution contains: a gold cyanide salt as a gold source; and a specific pyridinium compound in which an alkyl group is bonded to a nitrogen atom at the 1-position and one to five of the 2- to 6-positions are substituted with one kind or two or more kinds of specific substituents selected from the group consisting of an alkyl group, an aryl group, a carboxyl group, an alkoxycarbonyl group, a sulfo group, an alkoxysulfonyl group, an amino group, an alkylamino group, a dialkylamino group, and a cyano group. A gold film is produced by performing electrolytic gold plating on a nickel film using the electrolytic gold plating solution. 【課題】機械特性、耐摩耗性、電気特性等を良好に維持しつつ、金めっき皮膜の外観不良が発生することなく析出効率を従来の金めっき液よりも高くでき、金めっき析出時間の短縮化、金めっき液に含有する高価な金を低濃度化し生産コストを低減することが可能な電解金めっき液を提供すること。【解決手段】金源としてのシアン化金塩、並びに、１位の窒素原子にアルキル基が結合され、２位ないし６位の１個ないし５個が、アルキル基、アリール基、カルボキシ基、アルコキシカルボニル基、スルホ基、アルコキシスルホニル基、アミノ基、アルキルアミノ基、ジアルキルアミノ基及びシアノ基からなる群より選ばれた１種又は２種以上の特定置換基で置換された特定ピリジニウム化合物を含有することを特徴とする電解金めっき液、及び、該電解金めっき液を用いてニッケル皮膜上に電解金めっきを行うことによって得られた金皮膜。【選択図】なし