SOLDER ALLOY AND SOLDER POWDER

PROBLEM TO BE SOLVED: To provide a novel solder alloy that can suppress especially a viscosity increase after paste production regarding a solder alloy for producing solder paste.SOLUTION: The solder alloy includes one or more selected from the group consisting of Sn, Ag, Bi, Sb, Zn, In, and Cu, fur...

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Bibliographic Details
Main Authors GYODA KEIGO, UWAZUMI YOSHIAKI
Format Patent
LanguageEnglish
Japanese
Published 28.05.2015
Subjects
ALLOYS
CHEMISTRY
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
FERROUS OR NON-FERROUS ALLOYS
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
TREATMENT OF ALLOYS OR NON-FERROUS METALS
WELDING
WORKING BY LASER BEAM
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Summary:PROBLEM TO BE SOLVED: To provide a novel solder alloy that can suppress especially a viscosity increase after paste production regarding a solder alloy for producing solder paste.SOLUTION: The solder alloy includes one or more selected from the group consisting of Sn, Ag, Bi, Sb, Zn, In, and Cu, further includes 20 to 100 ppm As. 【課題】半田ペーストを作製するための半田合金に関し、特にペースト作製後の粘度上昇を抑制することができる、新たな半田合金を提供する。【解決手段】Ｓｎと、Ａｇ、Ｂｉ、Ｓｂ、Ｚｎ、Ｉｎ及びＣｕからなる群から選ばれる１種又は２種以上とを含み、かつ、２０ｐｐｍ〜１００ｐｐｍのＡｓを含むことを特徴とする半田合金を提案する。【選択図】なし
Bibliography:Application Number: JP20140142803