PLATING BATH FOR BISMUTH

• Main Authors: SAEKI ISAO, SUGA SHIGEYUKI, TOMIKAWA TAKASHI
• Format: Patent
• Language: English; Japanese
• Published: 21.05.2015
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

PROBLEM TO BE SOLVED: To provide a technique which enables electroplating of bismuth while preventing corrosion by acid.SOLUTION: A plating bath for bismuth consists of a first salt containing bismuth, a second bismuth-free salt, EDTA disodium and an additive, dissolved in water. With the concentration of the first salt as X [mol/L], the concentration of EDTA disodium as Y [mol/L] and the concentration of the second salt as Z [mol/L], the plating bath meets conditions 0.15≤X≤0.40, X≤Y≤0.80 and 0.50≤Z≤3.00. 【課題】酸による腐食を防止しつつビスマスの電気めっきを可能とする技術の提供。【解決手段】本発明のビスマスのめっき浴は、ビスマスを含む第１塩とビスマスを含まない第２塩とＥＤＴＡ二ナトリウムと添加剤とが水に溶解しためっき浴であって、前記第１塩の濃度をＸ［ｍｏｌ／Ｌ］とし、前記ＥＤＴＡ二ナトリウムの濃度をＹ［ｍｏｌ／Ｌ］とし、前記第２塩の濃度をＺ［ｍｏｌ／Ｌ］とすると、０．１５ Ｘ ０．４０、Ｘ Ｙ ０．８０、かつ、０．５０ Ｚ ３．００を満足する。【選択図】図２