METAL JOINT STRUCTURE USING METAL NANOPARTICLE, AND METAL JOINING METHOD AND METAL JOINT MATERIAL

PROBLEM TO BE SOLVED: To provide a metal joint structure by which when two metal materials to be joined are joined by use of a joint layer using metal nanoparticles, a joint strength of the joint layer can be sufficiently held even if said two materials to be joined have different heat deformation q...

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Bibliographic Details
Main Authors ISHIKAWA SHINJI, TANAKA MASAMOTO, TATSUMI KOHEI, MATSUBARA NORIE
Format Patent
LanguageEnglish
Japanese
Published 18.05.2015
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Summary:PROBLEM TO BE SOLVED: To provide a metal joint structure by which when two metal materials to be joined are joined by use of a joint layer using metal nanoparticles, a joint strength of the joint layer can be sufficiently held even if said two materials to be joined have different heat deformation quantities, and a metal joining method and a metal joint material.SOLUTION: A metal joint structure characterized in that a first joint layer 6 containing metal nanoparticles, a metal foil layer 7, and a second joint layer 8 containing metal nanoparticles are formed in this order between a joined surface (first joined surface) of a first joined body 1 and a second joining surface (second joined surface) of a second joined body 2. Even if there is a difference between thermal expansion quantities of the first material to be joined and the second material to be joined, the difference can be absorbed by deformation of the metal foil layer 7 in the joint structure, shear deformation quantities of the first joint layer 6 and the second joint layer 8 can be reduced, and a joint strength can be prevented from decreasing. 【課題】2つの被接合金属材料同士を金属ナノ粒子を用いた接合層によって接合するに際し、2つの被接合材の熱変形量が相違する場合であっても、接合層の接合強度を十分に保持することのできる金属接合構造及び金属接合方法並びに金属接合材料を提供する。【解決手段】第1被接合体1の被接合面(第1被接合面)と第2被接合体2の被接合面(第2被接合面)との間に、金属ナノ粒子を含む第1接合層6、金属箔層7、金属ナノ粒子を含む第2接合層8がこの順に形成されていることを特徴とする金属接合構造である。第1被接合体1と第2被接合体2の熱膨張量に差があっても、接合構造中の金属箔層7が変形することによって熱膨張量の差を吸収することができ、第1接合層6と第2接合層8のせん断変形量を低減し、接合強度の低下を防止することができる。【選択図】図1
Bibliography:Application Number: JP20130233117