POLYARYLENE SULFIDE FILM AND COMPOSITE BODY USING THE SAME

• Main Authors: TANAKA TAKASHI, MACHIDA TETSUYA, WAKAHARA YOKO
• Format: Patent
• Language: English; Japanese
• Published: 30.04.2015
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

PROBLEM TO BE SOLVED: To provide a polyarylene sulfide film excellent in adhesive properties with metal and/or a resin molded body, workability and quality as that of a film.SOLUTION: Provided is a polyarylene sulfide film composed of a polyarylene sulfide having a melting point of 265°C or lower, a resin (A) and a plasticizer (B) made of a thermoplastic resin having a melting point of 100 to 175°C. 【課題】本発明の課題は、上記した問題点を解決することにある。すなわち、金属および／または樹脂成形体との接着性、加工性、フィルムとしての品位に優れたポリアリーレンスルフィドフィルムを提供すること。【解決手段】融点が２６５℃以下であるポリアリーレンスルフィドと樹脂（Ａ）と、融点が１００〜１７５℃の熱可塑性樹脂からなる可塑剤（Ｂ）からなる、ポリアリーレンスルフィドフィルム。【選択図】 なし