SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device with high reliability and a method of manufacturing the same.SOLUTION: A semiconductor light-emitting device includes: a semiconductor layer; a sealing member covering a bottom surface and side surfaces of the semiconductor layer...

Full description

Saved in:
Bibliographic Details
Main Authors TOMIZAWA HIDEYUKI, KOJIMA AKIHIRO, FURUYAMA HIDETO, SUGIZAKI YOSHIAKI, FUJIMURA KAZUO, ITO SHINYA, NUNOTANI NOBUHITO, SHIMADA MIYOKO, MUKODA HIDEKO, ENDO MITSUYOSHI, AKIMOTO YOSUKE
Format Patent
LanguageEnglish
Japanese
Published 23.04.2015
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device with high reliability and a method of manufacturing the same.SOLUTION: A semiconductor light-emitting device includes: a semiconductor layer; a sealing member covering a bottom surface and side surfaces of the semiconductor layer, and protruding further upwardly than a top surface of the semiconductor layer at sides of the semiconductor layer; a phosphor layer provided above the semiconductor layer and the sealing member; and an insulating film provided between the semiconductor layer and the phosphor layer, and the sealing member. A projection portion of the sealing member is rounded. 【課題】信頼性が高い半導体発光装置及びその製造方法を提供する。【解決手段】実施形態に係る半導体発光装置は、半導体層と、前記半導体層の下面及び側面を覆い、前記半導体層の側方において前記半導体層の上面よりも上方に突出した封止部材と、前記半導体層及び前記封止部材の上方に設けられた蛍光体層と、前記半導体層及び前記蛍光体層と、前記封止部材との間に設けられた絶縁膜と、を備える。前記封止部材の突出部の角部は丸められている。【選択図】図1
Bibliography:Application Number: JP20140064515