POWER CONVERSION DEVICE
PROBLEM TO BE SOLVED: To provide both cooling performance and cost reduction of a power conversion device.SOLUTION: A power conversion device includes a power semiconductor module (300) for converting electric power, a flow path formation body (12) which forms a flow path in which a refrigerant that...
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Main Authors | , , |
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Format | Patent |
Language | English Japanese |
Published |
16.04.2015
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide both cooling performance and cost reduction of a power conversion device.SOLUTION: A power conversion device includes a power semiconductor module (300) for converting electric power, a flow path formation body (12) which forms a flow path in which a refrigerant that cools the power semiconductor module flows, inlet piping (13) connected to the flow path, and a housing (10) for housing the flow path formation body. The flow path formation body forms an inlet piping connection part (12a) that is connected to the inlet piping, and a seal part (407) for sealing between the housing and the flow path formation body. The housing forms an opening part (10a) which is opened larger than the inlet piping connection part. The inlet piping connection part is exposed from the opening part.
【課題】電力変換装置の冷却性能とコスト低減を両立することである。【解決手段】本発明に係る電力変換装置は、電力を変換するパワー半導体モジュール(300)と、前記パワー半導体モジュールを冷却する冷媒を流す流路を形成する流路形成体(12)と、前記流路と繋がる入口配管(13)と、前記流路形成体を収納するハウジング(10)と、を備え、前記流路形成体は、前記入口配管と接続される入口配管接続部(12a)と、前記ハウジングと当該流路形成体との間を密閉するためのシール部(407)と、を形成し、 前記ハウジングは、前記入口配管接続部よりも大きく開口した開口部(10a)を形成し、前記入口配管接続部は、前記開口部から露出される。【選択図】 図6 |
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Bibliography: | Application Number: JP20150009053 |