RESIN COMPOSITION, ADHESIVE ENCAPSULATION FILM, AND METHOD FOR PRODUCING THE SAME

• Main Authors: TATSUMI TOMOKO, ANDO MASATO, TANAKA TOSHIYUKI, KARASAWA TAMAE, KASAI TETSUO
• Format: Patent
• Language: English; Japanese
• Published: 16.04.2015
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PERFORMING OPERATIONS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

PROBLEM TO BE SOLVED: To provide a resin composition suitable for an adhesive encapsulation film having high adhesiveness and durability while maintaining a good moisture barrier property.SOLUTION: Provided is a resin composition comprising a block copolymer X containing a vinyl aromatic polymer block A and a block B of a polymer containing isobutylene as a main component, polyisobutylene, and a tackifier resin having a carbon double bond content of 1.6% or more and 50.0% or less. A content of the tackifier resin in the total solid content is 30 mass% or more. 【課題】良好な水分バリア性を維持しつつ、高い接着性及び耐久性を具備する接着性封止フィルム用に好適な樹脂組成物を提供する。【解決手段】ビニル芳香族重合体ブロックＡとイソブチレンを主体とする重合体のブロックＢとを有するブロック共重合体Ｘと、ポリイソブチレンと、炭素二重結合含有量が１．６％以上、５０．０％以下である粘着付与樹脂とを含有する樹脂組成物であって、全固形分中における前記粘着付与樹脂の含有量が３０質量％以上である樹脂組成物。【選択図】なし