PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD OF RESIN PATTERN, AND DISPLAY DEVICE

PROBLEM TO BE SOLVED: To provide a negative photosensitive resin composition from which a resin pattern having a normally tapered opening can be easily formed, a production method of a resin pattern using the photosensitive resin composition, and a display device including a resin pattern produced b...

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Bibliographic Details
Main Authors SAIJO HIDEKI, KATANO AKIRA
Format Patent
LanguageEnglish
Japanese
Published 13.04.2015
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Summary:PROBLEM TO BE SOLVED: To provide a negative photosensitive resin composition from which a resin pattern having a normally tapered opening can be easily formed, a production method of a resin pattern using the photosensitive resin composition, and a display device including a resin pattern produced by the above production method.SOLUTION: The photosensitive resin composition comprises (A) an alkali-soluble resin, (B) a photopolymerization initiator, and (C) a photopolymerizable compound. The (C) photopolymerizable compound contains a monofunctional monomer that shows a glass transition temperature of -10°C or lower when the monomer is prepared into a homopolymer having a mass average molecular weight of 10000 or more. 【課題】順テーパー形状の開口部を有する樹脂パターンを容易に形成可能なネガ型の感光性樹脂組成物、その感光性樹脂組成物を用いた樹脂パターンの製造方法、及びその製造方法によって製造された樹脂パターンを備える表示装置を提供する。【解決手段】本発明に係る感光性樹脂組成物は、(A)アルカリ可溶性樹脂、(B)光重合開始剤、及び(C)光重合性化合物を含有し、上記(C)光重合性化合物が、質量平均分子量10000以上のホモポリマーとしたときのガラス転移温度が−10℃以下となる単官能モノマーを含む。【選択図】なし
Bibliography:Application Number: JP20130205645