CERAMIC SUBSTRATE END FACE ELECTRODE FOR SURFACE-MOUNTED ELECTRONIC COMPONENT

• Main Author: HOSHIGAMI HIROSHI
• Format: Patent
• Language: English; Japanese
• Published: 09.04.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To electrically conduct between an end face electrode formed on a multilayer ceramic substrate and an inner layer electrode in a more reliable manner even when, in soldering the end face electrode and a set substrate, an edge part of the end face electrode is corroded due to solder and thereby disconnection is caused.SOLUTION: In a ceramic substrate end face electrode 3 for a surface-mounted electronic component, the end face electrode 3 provided at an edge part E of a ceramic substrate 2 is electrically connected to an inner layer electrode 5 by an inner layer electrode 6 for connection, the inner layer electrode 5 being formed in a through hole in the ceramic substrate 2. 【課題】多層セラミック基板に形成した端面電極とセット基板との半田付け時に、半田による端面電極のエッジ部分が腐食され、断線が生じても、端面電極と内層電極とをより確実に電気的に導通させる。【解決手段】表面実装型電子部品用のセラミック基板端面電極３において、セラミック基板２のエッジ部Ｅに設けられた該端面電極３が、前記セラミック基板２内のスルーホールに形成された内層電極５と、接続用内層電極６により電気的に接続される。【選択図】図１