MULTI-PIECE WIRING BOARD

• Main Author: ONIZUKA YOSHITOMO
• Format: Patent
• Language: English; Japanese
• Published: 30.03.2015
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a multi-piece wiring board which can keep good positioning property and good electrical conductivity even when downsizing of a wiring board region progresses.SOLUTION: A multi-piece wiring board comprises: a first notch 107 which is provided on a lateral face of a mother board 101 and extend in a vertical direction; a division groove 106 which is provided on a top face of the mother board 101 and extends from the first notch 107 in a direction along an outer edge of a wiring board region 102; and a second notch 108 which is provided on the mother board 101 in a part of a surface part of the first notch 107 and has a diameter smaller than that of the first notch 107 in planar view, in which an end of the division grove 106 lies in the second notch 108. Since a projection part is inhibited from going beyond an internal face of the first notch 107, favorable positioning and favorable electrical conductivity with reference to the first notch 107 of the mother board 101 can be performed. 【課題】配線基板領域の小型化が進んでも多数個取り配線基板の位置決め性や電気的な導通性を良好に保つことが可能な多数個取り配線基板を提供すること。【解決手段】母基板101の側面に、上下方向に延びる第１の切り欠き部107が設けられているとともに、母基板101の上面に、第１の切り欠き部107から、配線基板領域102の外辺に沿った方向に延びる分割溝106が設けられており、母基板101のうち第１の切り欠き部107の表面部分の一部に、平面視において第１の切り欠き部107よりも小径の第２の切り欠き部108が設けられており、第２の切り欠き部108内に分割溝106の端部が位置している多数個取り配線基板である。突出部が第１の切り欠き部107の内側面を越えることが抑制されるため、母基板101の第１の切り欠き部107を基準とした位置決めや電気的導通性を良好に行うことができる。【選択図】図１