ELECTROCHEMICAL CELL WITH LEAD TERMINAL

PROBLEM TO BE SOLVED: To provide an electrochemical cell with a lead terminal which enables secure soldering, inhibits variations in soldering when being mounted on a circuit board, and prevents the deterioration of the manufacturing yield of the circuit board.SOLUTION: A lead terminal 30 includes:...

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Bibliographic Details
Main Authors MITSUZUKA TERU, OGATA KENJI, TOMIZUKA KOJI, KOBAYASHI TOMOMI, SUZUKI TADAHITO
Format Patent
LanguageEnglish
Japanese
Published 30.03.2015
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Summary:PROBLEM TO BE SOLVED: To provide an electrochemical cell with a lead terminal which enables secure soldering, inhibits variations in soldering when being mounted on a circuit board, and prevents the deterioration of the manufacturing yield of the circuit board.SOLUTION: A lead terminal 30 includes: a welding part 31 welded to an electrochemical cell 20; an extension part 32 which is folded from the welding part 31 and extended to the circuit board 70 side; and a connection part 33 which continues from the extension part 32 and is connected with a circuit board 70 by soldering. The connection part 33 of the lead terminal 30 on at least one of the positive electrode side and the negative electrode side includes: a contact part 51 contacting with a surface (a solder surface 71) of the circuit board 70 which is soldered; and a clearance part 52 which is located adjacent to the contact part 51 and forms a clearance with the solder surface 71. 【課題】確実にハンダ付けをすることができ、回路基板への実装時のハンダ付けのばらつきを抑えることができ、回路基板の製造歩留の低下を抑えることが可能なリード端子付き電気化学セルを提供する。【解決手段】リード端子30は、電気化学セル20に溶接される溶接部31と、溶接部31から折曲され回路基板70側に延設される延設部32と、延設部32から回路基板70にハンダ付けにより接続される接続部33とを備え、正極側又は負極側の少なくともどちらか一方のリード端子30の接続部33は、回路基板70のハンダ付けされる面(ハンダ面71)に接触する接触部51と、この接触部51に隣接してハンダ面71との間に隙間を発生する間隙部52とを有することを特徴とする。【選択図】図2
Bibliography:Application Number: JP20130191481