METHOD FOR MANUFACTURING ELECTRONIC DEVICE

• Main Authors: IMURA FUMITO, KIKUCHI KATSUYA, FENG WEI, AOYAGI MASAHIRO, WATANABE NAOYA, KATO FUMIKI, NAKAGAWA HIROSHI, NEMOTO SHUNSUKE
• Format: Patent
• Language: English; Japanese
• Published: 26.03.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic device capable of achieving high bonding reliability even when an electrode pitch is made fine and controlling a gap between a wiring board and an electronic component (bump height).SOLUTION: A method for manufacturing an electronic device for bonding a plurality of metal wirings formed on a first substrate and a plurality of coning bumps formed on a second substrate comprises the steps of: bringing the plurality of metal wirings into contact with the plurality of coning bumps by lowering substrate holding means of the second substrate; pressurizing the plurality of coning bumps by further lowering the substrate holding means of the second substrate; and ending pressurization to the plurality of coning bumps when the pressurization reaches a prescribed load force. 【課題】電極ピッチを微細化しても、接合の信頼性が高く、配線基板と電子部品の空隙（バンプ高さ）を制御できる電子デバイスの製造方法を提供する。【解決手段】第一の基板に形成された複数の金属配線と第二の基板に形成された複数の錐型バンプとを接合する電子デバイスの製造方法であって、第二の基板の基板保持手段を降下させ、複数の金属配線と前記複数の錐型バンプを接触させる工程と、第二の基板の基板保持手段をさらに降下させることで複数の錐型バンプに加圧する工程と、複数の錐型バンプへの加圧が所定の荷重力となったところで加圧を終了する工程と、を有する電子デバイスの製造方法。【選択図】図４