DIE BONDER AND DIE BONDING METHOD

PROBLEM TO BE SOLVED: To provide highly reliable die bonder and die bonding method which allow for quick and accurate die bonding.SOLUTION: A die bonder includes a recognition mark provided on a substrate or the guide or shoot of a bonding head in the proximity of the substrate, and bonding position...

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Bibliographic Details
Main Author KUMAGAI DAISUKE
Format Patent
LanguageEnglish
Japanese
Published 23.03.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide highly reliable die bonder and die bonding method which allow for quick and accurate die bonding.SOLUTION: A die bonder includes a recognition mark provided on a substrate or the guide or shoot of a bonding head in the proximity of the substrate, and bonding position correction means including imaging means for imaging the recognition mark and a recognition mark provided near the die bonding position of the substrate and first position correction means for correcting the position of mechanical origin used for die bonding, based on the imaging data obtained by the imaging means. 【課題】ダイを正確にかつ迅速にボンディングできる信頼性の高いダイボンダ及びダイボンディング方法を提供する。【解決手段】基板または前記基板の近傍のボンディングヘッドテーブルのガイド上またはシュート上に設けられた認識マークと、前記認識マークと前記基板のダイ接着位置付近に設けられた認識マークとを撮像する撮像手段及び前記撮像手段によって得られた撮像データに基づいてダイボンディングに使用する機械的原点の位置を補正する第１の位置補正手段を具備するボンディング位置補正手段とを有する。【選択図】図４
Bibliography:Application Number: JP20130190530