SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To provide a semiconductor device which can improve voltage-withstanding characteristics by inhibiting flow of a leakage current caused by an inversion layer, an accumulation layer, and dislocation.SOLUTION: A semiconductor device comprises: a semiconductor substrate 1; and a f...
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Main Authors | , , , , , , , , , |
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Format | Patent |
Language | English Japanese |
Published |
23.03.2015
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a semiconductor device which can improve voltage-withstanding characteristics by inhibiting flow of a leakage current caused by an inversion layer, an accumulation layer, and dislocation.SOLUTION: A semiconductor device comprises: a semiconductor substrate 1; and a first film 2 formed on the semiconductor substrate 1. The semiconductor device further comprises: a first semiconductor layer 3 which is formed on the first film 2 and has a first conductivity type or an intrinsic type; and a second semiconductor layer 4 which is formed on the first semiconductor layer 3 and has a first conductivity type or an intrinsic type. The semiconductor device further comprises second conductivity type third semiconductor layers 11, 12 which have: a first upper part S3 which contacts the first semiconductor layer 3; a second upper part S4 which contacts the first film; a first side part S5 lying between the first upper part S3 and the second upper part S4; and a second side part S6 lying between the second upper part S4 and a lower part S2 of the semiconductor substrate.
【課題】反転層、蓄積層、および転位に起因するリーク電流の流れを抑制して、耐圧を向上させることが可能な半導体装置を提供する。【解決手段】半導体装置は、半導体基板1と、半導体基板1上に形成された第1の膜2とを備える。さらに、装置は、第1の膜2上に形成された第1導電型またはイントリンシック型の第1半導体層3と、第1半導体層3上に形成された第1導電型またはイントリンシック型の第2半導体層4とを備える。さらに、装置は、第1半導体層3に接する第1の上部S3と、第1の膜に接する第2の上部S4と、第1の上部S3と第2の上部S4との間に位置する第1の側部S5と、第2の上部S4と半導体基板の下部S2との間に位置する第2の側部S6と、を有する第2導電型の第3半導体層11、12を備える。【選択図】図1 |
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Bibliography: | Application Number: JP20130189746 |