SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

• Main Authors: TAKAYAMA SHINICHI, TONEDACHI TATSUO, ARAKI KOJI, OTANI KAZUMI
• Format: Patent
• Language: English; Japanese
• Published: 23.03.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a semiconductor device which avoids the occurrence of defects of the semiconductor device while improving the mounting capability of a semiconductor chip, and to provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device includes: a lead frame 11 including a chip mounting part 111 and a lead part 121 which is separated from the chip mounting part 111 and has the same thickness as the chip mounting part 111, the lead frame 11 where a height of an upper surface of the chip mounting part 111 is equal to a height of an upper surface of the lead part 121; a semiconductor chip 12 mounted on the upper surface of the chip mounting part 111 and electrically connected with the lead part 121; a mold resin 14 integrally sealing the lead frame 11 and the semiconductor chip 12; and a metallic film 15 which covers parts of rear surfaces of the chip mounting part 111 and the lead part 121. 【課題】半導体チップの搭載能力を高めつつ、半導体装置の不良発生を避けることができる半導体装置及びその製造方法を提供する。【解決手段】チップ搭載部１１１と、チップ搭載部１１１から隔てられ、チップ搭載部１１１と同じ厚さのリード部１２１とを有し、チップ搭載部１１１及びリード部１２１の上面の高さが同じであるリードフレーム１１と、チップ搭載部１１１の上面に搭載され、リード部１２１と電気的に接続された半導体チップ１２と、リードフレーム１１及び半導体チップ１２を一体的に封止するモールド樹脂１４と、チップ搭載部１１１及びリード部１２１の裏面の一部を覆う金属皮膜１５と、を有する。【選択図】図１