GRINDING METHOD OF THIN PLATE SUBSTRATE AND GRINDING DEVICE FOR USE THEREIN

• Main Authors: HORIE KAZUYA, TAKADA ATSUSHI, ISHIZAKI KOZO, OHASHI KYOSUKE, TAKATSU MASAKAZU
• Format: Patent
• Language: English; Japanese
• Published: 23.03.2015
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TOOLS FOR GRINDING, BUFFING, OR SHARPENING; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a grinding method of thin plate substrate capable of correcting the profile of a thin plate substrate to a flat ideal shape, in order to remove failure of exposure processing or epitaxial processing, for example, and to provide a grinding device for use therein.SOLUTION: In a grinding method of a thin plate substrate the profile of which has a warpage, shape correction is performed by grinding the thin plate substrate while holding in a shape having a warpage by supplying slurry, having a cooling liquid and a chemical polishing agent, from the whole surface of a grind stone through an open pore in the grind stone, or by supplying a mixture thereof between the thin plate substrate and grind stone, when grinding the thin plate substrate from both sides, thereby applying a hydrostatic pressure to both sides of the thin plate substrate. 【課題】例えば露光処理、エピタキシアル処理などの障害を取り除くため、薄板基板の断面形状を平坦な理想的な形状に補正することができる、薄板基板の研削加工方法およびそれに用いる研削加工装置を提供する。【解決手段】断面形状が反りを有する薄板基板の研削加工方法であって、該薄板基板の両面から砥石を用いて研削する際に、砥石が有する開気孔を介して該砥石の全面から、冷却液、化学研磨剤を有するスラリー、またはこれらの混合物を薄板基板と砥石との間に供給し、薄板基板の両面に静水圧をかけて反りを有する形状に保持しつつ研削することにより形状補正を行う。【選択図】図３