METHOD FOR FORMING CONDUCTIVE PATTERN AND CONDUCTIVE PATTERN
PROBLEM TO BE SOLVED: To provide: a method for forming a conductive pattern, in which process efficiency is improved by deforming a shape of a fine groove formed in a substrate, and electrical characteristics and optical characteristics of the conductive pattern can be easily controlled by adjusting...
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Main Authors | , , , , |
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Format | Patent |
Language | English Japanese |
Published |
19.03.2015
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide: a method for forming a conductive pattern, in which process efficiency is improved by deforming a shape of a fine groove formed in a substrate, and electrical characteristics and optical characteristics of the conductive pattern can be easily controlled by adjusting a conductive ink composition; and a conductive pattern.SOLUTION: A method for forming a conductive pattern includes: a groove forming step of forming a groove in a substrate having such a feature that at least a part of sections has a width decreasing along a depth direction from the surface; a filling step of filling the inside of the groove with a conductive ink composition; and a drying step of drying the conductive ink composition so that a solvent contained in the conductive ink composition inside the groove is volatilized.
【課題】基板に形成される微細溝の形状を変形して、工程効率を改善するとともに、導電性インク組成物の成分を調節して、電気的特性及び光学的特性を容易に制御することができる導電性パターンの形成方法及び導電性パターンを提供すること。【解決手段】基板上に少なくとも一部区間が表面から深さ方向に沿って、幅が減少する形態の溝を形成する溝形成段階と、前記溝の内部に導電性インク組成物を充填する充填段階と、前記溝内部の導電性インク組成物に含まれる溶媒が揮発するように乾燥する乾燥段階とを含むことを特徴とする導電性パターンの形成方法。【選択図】図1 |
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Bibliography: | Application Number: JP20140182524 |