RESIN COMPOSITION, FIRST-SUPPLY TYPE SEMICONDUCTOR SEALANT AND SEMICONDUCTOR DEVICE

• Main Authors: MUNEMURA SHINICHI, SAKAI YOSUKE, HOCCHI TOYOKAZU
• Format: Patent
• Language: English; Japanese
• Published: 19.03.2015
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

PROBLEM TO BE SOLVED: To provide a non-epoxy resin composition for a first-supply type process.SOLUTION: A resin composition comprises (A) EO modified bisphenol A dimethacrylate, (B) tricyclodecanedimethanol diacrylate, (C) trimethylolpropane triacrylate, (D) organic peroxide, (E) butadiene and maleic anhydride copolymer, (F) bismaleimide, and (G) silica filler. 【課題】先供給型プロセス用の非エポキシ系樹脂組成物を提供する。【解決手段】樹脂組成物は、（Ａ）ＥＯ変性ビスフェノールＡジメタクリレートと、（Ｂ）トリシクロデカンジメタノールジアクリレートと、（Ｃ）トリメチロールプロパントリアクリレートと、（Ｄ）有機過酸化物と、（Ｅ）ブタジエンと無水マレイン酸共重合体と、（Ｆ）ビスマレイミドと、（Ｇ）シリカフィラーとを含む。【選択図】なし