IMAGING APPARATUS AND CAMERA

• Main Author: INUI FUMIHIRO
• Format: Patent
• Language: English; Japanese
• Published: 16.03.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PICTORIAL COMMUNICATION, e.g. TELEVISION; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a technique advantageous for facilitating a shading correction process while reducing the number of contacts used to apply a potential to a substrate.SOLUTION: An imaging apparatus comprises: a pixel array in which a plurality of pixels are arranged in a semiconductor area; a pad part for receiving a reference voltage; a plurality of first power source wiring patterns arranged on the pixel array along a first direction, which is either one of the column direction and row direction of the pixel array; a second power source wiring pattern arranged on an area outside the pixel array along a second direction, which is the other of the column direction and row direction of the pixel array, and configured to electrically connect the first power source wiring patterns and the pad part; and a plurality of contacts that electrically connect the first power source wiring patterns and the semiconductor area. The resistance value of the second power source wiring patterns in the second direction is smaller than the resistance value of the first power source wiring patterns in the first direction. 【課題】基板に電位を与えるためのコンタクトの数量を低減しつつシェーディング補正処理を容易化するのに有利な技術を提供する。【解決手段】撮像装置は、半導体領域に複数の画素が配列された画素アレイと、基準電圧を受けるためのパッド部と、前記画素アレイの上に、前記画素アレイの行方向および列方向のうちの一方である第１方向に沿ってそれぞれ配された複数の第１電源配線パターンと、前記画素アレイの外側の領域の上に、前記画素アレイの行方向および列方向のうちの他方である第２方向に沿って配され、前記複数の第１電源配線パターンと前記パッド部とを電気的に接続する第２電源配線パターンと、前記複数の第１電源配線パターンと前記半導体領域とを電気的に接続する複数のコンタクトと、を備え、前記第２電源配線パターンの前記第２方向における抵抗値は、前記複数の第１電源配線パターンのそれぞれの前記第１方向における抵抗値よりも小さい。【選択図】図１