SUBSTRATE PROCESSING APPARATUS

• Main Authors: HIGUCHI AYUMI, HONSHO KAZUHIRO, YOSHIZUMI ASUKA
• Format: Patent
• Language: English; Japanese
• Published: 16.03.2015
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPARATUS SPECIALLY ADAPTED THEREFOR; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PERFORMING OPERATIONS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of preventing a cleaning liquid from splashing due to interference with chuck pins when a substrate is washed by using a spin base.SOLUTION: A plurality of chuck pins 26 are stood on a base surface 21a of a spin base 21 which holds a substrate. Inclined pieces 71 each having a right triangle-shaped cross section are arranged inside the chuck pins 26 on the base surface 21a. When a cleaning liquid is supplied on the base surface 21a while the spin base 21 rotates, the cleaning liquid flows from the center side of the base surface 21a toward an outer periphery thereof by centrifugal force. Part of the cleaning liquid flowing toward the outer periphery is guided by the inclined pieces 71 so as to be splashed toward a diagonally upward direction of the spin base 21 and sprayed at the upper curved part of a processing cup 40. Since the cleaning liquid splashed toward the diagonally upward direction by the inclined pieces 71 splashes without interfering with the chuck pins 26, it is possible to prevent the cleaning liquid from scattering. 【課題】スピンベースを用いての洗浄時にチャックピンによる液はねを防止することができる基板処理装置を提供する。【解決手段】基板を保持するためのスピンベース２１のベース面２１ａ上には複数のチャックピン２６が立設されている。そのベース面２１ａ上のチャックピン２６よりも内側には、断面形状が直角三角形である傾斜片７１が設けられている。スピンベース２１を回転させつつベース面２１ａ上に洗浄液を供給すると、洗浄液は遠心力によってベース面２１ａの中心側から外周へと向けて流れる。外周へと向けて流れる洗浄液の一部は傾斜片７１によって案内されてスピンベース２１の斜め上方に向けて飛散され、処理カップ４０の上側湾曲部分吹き付けられる。また、傾斜片７１によって斜め上方に向けて飛散された洗浄液は、チャックピン２６と干渉することなく飛翔するため液はねは生じない。【選択図】図５