HEAT SINK AND SUBSTRATE UNIT

PROBLEM TO BE SOLVED: To inhibit limitations from being imposed on the arrangement of a heating element as one aspect.SOLUTION: Multiple electronic components 14, 16 are mounted on a printed circuit board 12. Further, a heat sink 18 is provided on the one electronic component 14 and a heat sink 20 i...

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Bibliographic Details
Main Authors MAKABE EIJI, AIZAWA OSAMU, SO TAKESHI, UZUKA YOSHINORI
Format Patent
LanguageEnglish
Japanese
Published 16.03.2015
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To inhibit limitations from being imposed on the arrangement of a heating element as one aspect.SOLUTION: Multiple electronic components 14, 16 are mounted on a printed circuit board 12. Further, a heat sink 18 is provided on the one electronic component 14 and a heat sink 20 is provided on the other electronic component 16. The heat sink 20 includes: a fixed part 42 fixed to the electronic component 16; and a heat radiation part 44 which has multiple fins 56 and slides relative to the fixed part 42. 【課題】一つの側面として、発熱体の配置に制限が生じることを抑制することを目的とする。【解決手段】プリント基板１２には、複数の電子部品１４，１６が実装されている。また、一方の電子部品１４には、ヒートシンク１８が設けられ、他方の電子部品１６には、ヒートシンク２０が設けられている。ヒートシンク２０は、電子部品１６に固定された固定部４２と、複数のフィン５６を有し固定部４２に対してスライドする放熱部４４とを備えている。【選択図】図１
Bibliography:Application Number: JP20130179771