SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
PROBLEM TO BE SOLVED: To strengthen joint of a semiconductor element and a terminal in a semiconductor device.SOLUTION: A semiconductor device comprises a plurality of columnar terminals 6, a semiconductor element 2, and solders 8 which are provided on a surface of the semiconductor element 2 and co...
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| Main Authors | , |
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| Format | Patent |
| Language | English Japanese |
| Published |
16.03.2015
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| Subjects | |
| Online Access | Get full text |
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| Abstract | PROBLEM TO BE SOLVED: To strengthen joint of a semiconductor element and a terminal in a semiconductor device.SOLUTION: A semiconductor device comprises a plurality of columnar terminals 6, a semiconductor element 2, and solders 8 which are provided on a surface of the semiconductor element 2 and connect the semiconductor element 2 and the plurality of columnar terminals 6, respectively.
【課題】半導体装置において、半導体素子と端子との接合を強固にすること。【解決手段】複数の柱状端子６と、半導体素子２と、半導体素子２の表面に設けられ、半導体素子２と複数の柱状端子６とを接続するはんだ８とを有する半導体装置による。【選択図】図１３ |
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| AbstractList | PROBLEM TO BE SOLVED: To strengthen joint of a semiconductor element and a terminal in a semiconductor device.SOLUTION: A semiconductor device comprises a plurality of columnar terminals 6, a semiconductor element 2, and solders 8 which are provided on a surface of the semiconductor element 2 and connect the semiconductor element 2 and the plurality of columnar terminals 6, respectively.
【課題】半導体装置において、半導体素子と端子との接合を強固にすること。【解決手段】複数の柱状端子６と、半導体素子２と、半導体素子２の表面に設けられ、半導体素子２と複数の柱状端子６とを接続するはんだ８とを有する半導体装置による。【選択図】図１３ |
| Author | SHIMIZU KOZO SAKUYAMA SEIKI |
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| Discipline | Medicine Chemistry Sciences |
| DocumentTitleAlternate | 半導体装置、電子装置、及び半導体装置の製造方法 |
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| Notes | Application Number: JP20130179691 |
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| RelatedCompanies | FUJITSU LTD |
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| Snippet | PROBLEM TO BE SOLVED: To strengthen joint of a semiconductor element and a terminal in a semiconductor device.SOLUTION: A semiconductor device comprises a... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
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