SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
PROBLEM TO BE SOLVED: To strengthen joint of a semiconductor element and a terminal in a semiconductor device.SOLUTION: A semiconductor device comprises a plurality of columnar terminals 6, a semiconductor element 2, and solders 8 which are provided on a surface of the semiconductor element 2 and co...
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Main Authors | , |
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Format | Patent |
Language | English Japanese |
Published |
16.03.2015
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To strengthen joint of a semiconductor element and a terminal in a semiconductor device.SOLUTION: A semiconductor device comprises a plurality of columnar terminals 6, a semiconductor element 2, and solders 8 which are provided on a surface of the semiconductor element 2 and connect the semiconductor element 2 and the plurality of columnar terminals 6, respectively.
【課題】半導体装置において、半導体素子と端子との接合を強固にすること。【解決手段】複数の柱状端子6と、半導体素子2と、半導体素子2の表面に設けられ、半導体素子2と複数の柱状端子6とを接続するはんだ8とを有する半導体装置による。【選択図】図13 |
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Bibliography: | Application Number: JP20130179691 |