SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To strengthen joint of a semiconductor element and a terminal in a semiconductor device.SOLUTION: A semiconductor device comprises a plurality of columnar terminals 6, a semiconductor element 2, and solders 8 which are provided on a surface of the semiconductor element 2 and co...

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Bibliographic Details
Main Authors SAKUYAMA SEIKI, SHIMIZU KOZO
Format Patent
LanguageEnglish
Japanese
Published 16.03.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To strengthen joint of a semiconductor element and a terminal in a semiconductor device.SOLUTION: A semiconductor device comprises a plurality of columnar terminals 6, a semiconductor element 2, and solders 8 which are provided on a surface of the semiconductor element 2 and connect the semiconductor element 2 and the plurality of columnar terminals 6, respectively. 【課題】半導体装置において、半導体素子と端子との接合を強固にすること。【解決手段】複数の柱状端子６と、半導体素子２と、半導体素子２の表面に設けられ、半導体素子２と複数の柱状端子６とを接続するはんだ８とを有する半導体装置による。【選択図】図１３
Bibliography:Application Number: JP20130179691