LAMINATE SEALANT FILM

PROBLEM TO BE SOLVED: To provide a laminate sealant film capable of forming a package form having constant openability regardless of a heat seal condition during packaging.SOLUTION: The laminate sealant film is manufactured by laminating a laminate layer (A)/intermediate layer (B)/seal layer (C) in...

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Bibliographic Details
Main Authors TAJIMA TOMOKI, KURAMOTO NAOHIKO
Format Patent
LanguageEnglish
Japanese
Published 16.03.2015
Subjects
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Summary:PROBLEM TO BE SOLVED: To provide a laminate sealant film capable of forming a package form having constant openability regardless of a heat seal condition during packaging.SOLUTION: The laminate sealant film is manufactured by laminating a laminate layer (A)/intermediate layer (B)/seal layer (C) in this order, the laminate layer (A) has a thickness of 3 to 50 μm and contains 100 pts.mass of linear low-density polyethylene (A1) and 30 to 300 pts.mass of a polypropylene resin having the melting point of 140 to 165°C (A2), the intermediate layer (B) contains a polypropylene resin (B1) having the melting point of 140 to 165°C and the seal layer (C) contains a low melting point polypropylene resin (C1) having the melting point of 15 to 60°C lower than that of the polypropylene resin (B1) constituting the intermediate layer (B). 【課題】 包装時のヒートシール条件に関わらず、開封性の一定した包装形態を形成しうる多層シーラントフィルムを提供すること。【解決手段】 本発明の多層シーラントフィルムは、ラミネート層(A)/中間層(B)/シール層(C)がこの順に積層してなり、厚みが3〜50μmのラミネート層(A)が、直鎖状低密度ポリエチレン(A1)100質量部と、融点が140〜165℃のポリプロピレン系樹脂(A2)30〜300質量部とを含み、中間層(B)が、融点140〜165℃のポリプロピレン系樹脂(B1)を含み、シール層(C)が、中間層(B)を構成するポリプロピレン系樹脂(B1)よりも15〜60℃低い融点の低融点ポリプロピレン系樹脂(C1)を含むことを特徴とする。【選択図】 図2
Bibliography:Application Number: JP20130183228