CERAMIC ELECTRONIC COMPONENT

• Main Authors: TAMAKI KENYA, ONODERA SHINYA, MORITA TAKESHI, TAMURA TAKEHISA, ITO TAKAYOSHI
• Format: Patent
• Language: English; Japanese
• Published: 12.03.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE; ELECTRICITY; INDUCTANCES; MAGNETS; RESISTORS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES; TRANSFORMERS

PROBLEM TO BE SOLVED: To provide a ceramic electronic component in which self alignment is enhanced when soldering.SOLUTION: In a ceramic electronic component 1, an insulating resin coating layer 21 continuously covers the surface at the end faces 3a, 4b of external electrodes 3, 4, and the side faces 3e, 3f, 4e, 4f, and a part of the surface at the principal surfaces 3d, 4d of external electrodes 3, 4 covering the first principal surface 2d becoming the mounting surface, and wraps from the side of the end faces 3a, 4b and the side of the end faces 3e, 3f, 4e, 4f to the side of the principal surfaces 3d, 4d. Consequently, creeping of solder between the external electrodes 3, 4 and an insulating resin coating layer 21 delays, resulting in high self alignment. 【課題】はんだ実装時におけるセルフアライメント性の向上が図られたセラミック電子部品を提供する。【解決手段】セラミック電子部品１においては、絶縁性樹脂コーティング層２１が、外部電極３、４の端面部分３ａ、４ｂおよび側面部分３ｅ、３ｆ、４ｅ、４ｆの表面と、実装面となるべき第１の主面２ｄを覆う外部電極３、４の主面部分３ｄ、４ｄの表面の一部とを連続的に覆い、端面部分３ａ、４ｂの側および側面部分３ｅ、３ｆ、４ｅ、４ｆの側から主面部分３ｄ、４ｄの側に回り込むことで、外部電極３、４と絶縁性樹脂コーティング層２１との間におけるはんだの這い上がりが遅延し、高いセルフアライメント性を得ることができる。【選択図】図１