LEAD-FREE TIN ALLOY ELECTROPLATING COMPOSITIONS AND METHODS

• Main Authors: LUO YU, TOBEN MICHAEL P, BROWN NEIL D
• Format: Patent
• Language: English; Japanese
• Published: 12.03.2015
• Subjects: APPARATUS THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMISTRY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide lead-free tin alloy electroplating compositions and methods.SOLUTION: Disclosed are electrolyte compositions for depositing a tin alloy on a substrate. The electrolyte compositions include tin ions, ions of one or more alloying metals, a flavone compound and a dihydroxy bis-sulfide. The electrolyte compositions are free of lead and cyanide. Also disclosed are methods of depositing a tin alloy on a substrate and methods of forming an interconnect bump on a semiconductor device. 【課題】鉛を含まないスズ合金電気めっき組成物および方法を提供する。【解決手段】基体上にスズ合金を堆積するための電解質組成物が開示される。電解質組成物はスズイオン、一種以上の合金形成金属のイオン、フラボン化合物およびジヒドロキシビス−スルフィドを含む。電解質組成物は鉛およびシアン化物を含まない。基体上にスズ合金を堆積する方法および半導体素子上に相互接続バンプを形成する方法も開示される。【選択図】なし