SOUND INSULATION FLOOR COMPONENT, AND SOUND INSULATION FLOOR STRUCTURE

PROBLEM TO BE SOLVED: To provide a sound insulation floor structure that can suppress sinking of a floor material due to a walk so as to provide an excellent walk feeling, and has high sound insulation performance against a floor impact sound.SOLUTION: A sound insulation floor structure is formed by...

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Main Authors ADACHI ATSUMI, TAKAMATSU MASAHIKO, KOIZUMI SATOSHI, KOIKE TAKERU, KINDEI HIDENORI, MIYAIE NOBORU, KIYOOKA SUMITO
Format Patent
LanguageEnglish
Japanese
Published 05.03.2015
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Summary:PROBLEM TO BE SOLVED: To provide a sound insulation floor structure that can suppress sinking of a floor material due to a walk so as to provide an excellent walk feeling, and has high sound insulation performance against a floor impact sound.SOLUTION: A sound insulation floor structure is formed by: placing, a first hard layer 2, rod-like floor joists 3 which are sectioned in a rectangular shape perpendicularly to a length direction and arranged parallel to each other at intervals, a second hard layer 5, and a floor finish layer 6 in order on a floor substrate material 1; and sequentially stacking and arranging or inserting non-buffer layers 7 and buffer layers 4 between adjacent floor joists 3, adjacently to and alternately with the floor joists 3. The total thickness of the non-buffer layers 7 and the buffer layers is larger than that of the floor joists and reduced to a thickness of the floor joists by compressing the buffer layers 4. The non-buffer layers may be formed of vibration dampers of 2.2 to 3.6 in specific gravity. A thickness of the buffer layers may be 1.05 to 3 times as large as a thickness obtained by subtracting a thickness of the non-buffer layers from the thickness of the floor joists. 【課題】歩行による床材の沈み込みを抑制でき、良好な歩行感が得られるとともに、床衝撃音の遮音性能も高い遮音床構造を提供する。【解決手段】床下地材1の上に、第1の硬質層2、長手方向に垂直な断面形状が長方形状であり、かつ間隔をおいて平行に配設されている棒状根太3、第2の硬質層5、床仕上げ層6が順次重ね合わせ、隣り合う根太3の間に、これらの根太3と交互に隣接して非緩衝層7及び緩衝層4が順次積層して配設又は挿入して、遮音床構造を形成する。前記非緩衝層7及び前記緩衝層の合計厚みは、根太よりも大きく、前記緩衝層4の圧縮により、根太の厚みにまで圧縮されている。前記非緩衝層は比重2.2〜3.6の制振材で構成されていてもよい。前記緩衝層の厚みは、前記根太の厚みから前記非緩衝層の厚みを減じた厚みに対して1.05〜3倍であってもよい。【選択図】図2
Bibliography:Application Number: JP20140220020