WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

• Main Authors: INADA TEIICHI, HIROYAMA YUKIHISA, NAOYUKI SUSUMU, TATENO KIICHI
• Format: Patent
• Language: English; Japanese
• Published: 02.03.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a wiring board which can be thinned and has good flexibility, and a method for manufacturing the same.SOLUTION: The wiring board (1) contains a base material part (10) consisting of a metal layer (20) having a first main surface (22), a second main surface (24) and a side surface (24) and formed into the pattern shape, and a first insulation layer (30) arranged around the metal layer (20); a second insulation layer (30) covering the first main surface (22) of the metal layer (20); and a third insulation layer (50) covering the metal layer (20) and the second main surface (24). 【課題】薄型化可能であり、優れたフレキシブル性を有する配線基板およびその製造方法を提供する。【解決手段】本発明の配線基板（１）は、第１の主面（２２）、第２の主面（２４）および側面（２４）を有しパターン状に形成された金属層（２０）と金属層（２０）の周囲に配置された第１の絶縁層（３０）とからなる基材部（１０）、金属層（２０）の第１の主面（２２）を覆う第２の絶縁層（３０）、および金属層（２０）の第２の主面（２４）を覆う第３の絶縁層（５０）を含む。【選択図】図２