PROCESS FOR MANUFACTURING PRINTED WIRING BOARD HAVING ELECTRICALLY CONDUCTIVE CONSTRAINING CORE

• Main Author: VASOYA KALU K
• Format: Patent
• Language: English; Japanese
• Published: 26.02.2015
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board including an electrically conductive constraining core which involves a single lamination cycle.SOLUTION: The method includes the steps of: drilling a clearance pattern in an electrically conductive constraining core 20; arranging the electrically conductive constraining core in a stack-up that includes B-stage (semicured) layers of dielectric material on either side of the constraining core and additional layers of material arranged to form at least one functional layer; and performing a lamination cycle on the stack-up that causes resin in the B-stage (semicured) layers of dielectric to reflow and fill the clearance pattern in the electrically conductive constraining core before curing and drilling plated through holes. 【課題】単一のラミネーションサイクルを伴う導電性拘束コアを含む印刷配線基板を製造する方法の開示。【解決手段】導電性拘束コア２０にクリアランスパターンを穿孔する段階と、拘束コアのそれぞれの面上の誘電性材料のＢステージ（半硬化）層及び少なくとも１つの機能層を形成するべく配置された追加の材料層を含む積層体内に導電性拘束コアを配置する段階と、硬化及び鍍金スルーホールの穿孔の前に、誘電体のＢステージ（半硬化）層内の樹脂をリフローさせて導電性拘束コアのクリアランスパターンを充填する積層体に対するラミネーションサイクルを実行する段階と、を含んでいる。【選択図】図２