IMAGE SENSOR MODULE REDUCING ENTIRE THICKNESS AND MANUFACTURING METHOD OF THE SAME

• Main Author: HSU CHI-HSING
• Format: Patent
• Language: English; Japanese
• Published: 23.02.2015
• Subjects: ELECTRIC COMMUNICATION TECHNIQUE; ELECTRICITY; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PHYSICS; PICTORIAL COMMUNICATION, e.g. TELEVISION

PROBLEM TO BE SOLVED: To provide an image sensor module which reduces its entire thickness, and to provide a manufacturing method of the image sensor module.SOLUTION: An image sensor module includes: an image sensor unit including an image sensor element having an image sensor region on its upper surface; a translucent unit including a translucent element which is supported above the image sensor element through multiple support mediums; a substrate unit including a flexible substrate which is installed on the image sensor element through multiple conductors and is electrically connected with the image sensor element; and a lens unit including a non-translucent frame, which is installed on the flexible substrate and is used for covering the translucent element, and a lens element which is connected with the non-translucent frame and is installed above the translucent element. 【課題】全体厚さを低減させるイメージセンサモジュール及びその製造方法を提供することを課題とする。【解決手段】イメージセンサモジュールは、その上面にイメージセンサ領域を有するイメージセンサ素子を含むイメージセンサユニットと、複数の支持体を介してイメージセンサ素子の上方に支持される透光素子を含む透光ユニットと、複数の導電体を介してイメージセンサ素子の上に設置されると共にイメージセンサ素子に電気的に接続されるフレキシブル基板を含む基板ユニットと、フレキシブル基板の上に設置されると共に透光素子を覆うための非透光フレームと、非透光フレームに接続されると共に透光素子の上方に設置されるレンズエレメントとを含むレンズユニットとを含む。【選択図】図４