PRINTED CIRCUIT BOARD

• Main Authors: SASAKI YUICHI, OHASHI HIDEMASA, NAKAMOTO HISAYUKI, MOTOHASHI AYUMI, OKA NAOTO
• Format: Patent
• Language: English; Japanese
• Published: 19.02.2015
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To inhibit radiation noise from a differential line to improve noise resistance.SOLUTION: A printed circuit board according to the present embodiment comprises a layer for mounting wiring and a component, and a ground layer. The layer for mounting the wiring and the component includes: a differential line composed of a first conductor and a second conductor; first and second components which are placed at positions adjacent to each other across the differential line; a first conductor for connecting the first component and the first conductor; and a second connection conductor for connecting the second component and the second conductor. The circuit board further comprises: a first metal pattern formed between the layer for mounting the wiring and the component and to ground layer, and at a position just below the first connection conductor and the first component; and a second metal pattern formed between the layer for mounting the wiring and the component and to ground layer, and at a position just below the second connection conductor and the second component, in which the first conductor or the first connection conductor is electrically connected with the first metal pattern, and the first conductor or the second connection conductor is electrically connected with the second metal pattern. 【課題】 差動線路からの放射ノイズを抑制し、耐ノイズ性を向上させる。【解決手段】 この発明に係るプリント回路基板は、配線及び部品を実装する層とグラウンド層とを有し、配線及び部品を実装する層に形成された第１の導体と第２の導体から成る差動線路と、差動線路をはさみ近接した位置に置かれた第１、第２の部品と、第１の部品と第１の導体とを接続する第１の接続導体と、第２の部品と第２の導体とを接続する第２の接続導体とを備え、配線及び部品を実装する層およびグラウンド層の間の層に、第１の接続導体および第１の部品の直下の位置に形成した第１の金属パターンと、第２の接続導体および第２の部品の直下の位置に形成した第２の金属パターンとを備え、第１の導体または第１の接続導体と第１の金属パターンおよび第２の導体または第２の接続導体と第２の金属パターンを、それぞれ電気的に接続した。【選択図】 図１