PIEZOELECTRIC VIBRATION ELEMENT MOUNTING SUBSTRATE AND PIEZOELECTRIC DEVICE

PROBLEM TO BE SOLVED: To provide a piezoelectric vibration element mounting substrate which is effective for achieving low resistance in external connection of a thermistor element mounted thereon, and to provide a piezoelectric device.SOLUTION: A piezoelectric vibration element mounting substrate i...

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Bibliographic Details
Main Author ONIZUKA YOSHITOMO
Format Patent
LanguageEnglish
Japanese
Published 12.02.2015
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Summary:PROBLEM TO BE SOLVED: To provide a piezoelectric vibration element mounting substrate which is effective for achieving low resistance in external connection of a thermistor element mounted thereon, and to provide a piezoelectric device.SOLUTION: A piezoelectric vibration element mounting substrate includes: an insulation base 101 having a lower surface on which a thermistor element 102 is mounted, an upper surface on which a piezoelectric vibration element 105 is mounted, and a side surface; a second external electrode 108 which is provided on the lower surface of the insulation base 101 and is connected with the piezoelectric vibration element 105; a first external electrode 109; a side surface electrode 110 provided on the side surface; and a connection conductor 103 which is provided ranging from a first mounting part 104 to the side surface electrode 110. One end part of the first external electrode 109 is located close to the side surface electrode 110. Conduction resistance from the thermistor element 102 to the first external electrode 109 is suppressed to a low level by the connection conductor 103 and the side surface electrode 110 etc. 【課題】 搭載されるサーミスタ素子の外部接続における低抵抗化に有効な圧電振動素子搭載用基板、および圧電装置を提供すること。【解決手段】 サーミスタ素子102が搭載される下面、圧電振動素子105が搭載される上面、および側面を有する絶縁基体101と、絶縁基体101の下面に設けられた、圧電振動素子105に接続される第2外部電極108と、第1外部電極109と、側面に設けられた側面電極110と、第1搭載部104から側面電極110にかけて設けられた接続導体103とを備えており、第1外部電極109の一端部が側面電極110に近接している圧電振動素子搭載用基板である。サーミスタ素子102から第1外部電極109までの導通抵抗を、接続導体103および側面電極110等により低く抑えることができる。【選択図】 図3
Bibliography:Application Number: JP20130157869