ELECTRONIC APPARATUS

• Main Authors: NAKAMURA TOSHIHIRO, TAKENAKA MASAYUKI, IMAIZUMI NORIHISA
• Format: Patent
• Language: English; Japanese
• Published: 05.02.2015
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide an electronic apparatus having a structure that can achieve a reduced size.SOLUTION: A substrate 10 on which electronic components 20, 30 are mounted to be sealed with a mold resin 40 is housed within a housing recess 63 so that a one surface 11 side faces a bottom surface 61 side. That is, the substrate 10 is housed within the housing recess 63 such that a tip of a connection terminal 65 is inserted from a side of a surface on which the mold resin 40 is disposed, the side being a mounting surface side of the electronic components 20, 30, and the mold resin 40 is located between the tip position of the connection terminal 65 and the root position thereof. Thus, a dead space almost equal to the height of the mold resin 40 cannot be formed, and the length of the connection terminal 65 can be gained. Accordingly, an electronic apparatus having a structure that can achieve a reduced size and secure connection reliability can be provided. 【課題】小型化を図ることが可能な構造の電子装置を提供する。【解決手段】電子部品２０、３０を実装してモールド樹脂４０で封止した基板１０を、一面１１側が底面６１側を向くようにして収容凹部６３内に収容する。つまり、電子部品２０、３０の実装面側であって、モールド樹脂４０が配置された面側から接続端子６５の先端部が挿入され、モールド樹脂４０が接続端子６５の先端位置より根元位置までの間に位置するようにして基板１０を収容凹部６３内に収容する。これにより、モールド樹脂４０の高さ分のデッドスペースが形成されないようにできると共に、接続端子６５の長さを稼ぐことができる。したがって、小型化が図れると共に接続信頼性を確保することが可能な構造の電子装置とすることが可能となる。【選択図】図１