HIGH FREQUENCY MODULE

PROBLEM TO BE SOLVED: To provide a high frequency module in which a test terminal can be installed without increasing a substrate area.SOLUTION: The high frequency module includes: a module substrate 110 having a transmitting antenna 111 and a receiving antenna 112 on a first surface and having a si...

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Bibliographic Details
Main Authors SHIOZAKI RYOSUKE, KASHINO YUICHI, FUJITA TAKU
Format Patent
LanguageEnglish
Japanese
Published 02.02.2015
Subjects
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To provide a high frequency module in which a test terminal can be installed without increasing a substrate area.SOLUTION: The high frequency module includes: a module substrate 110 having a transmitting antenna 111 and a receiving antenna 112 on a first surface and having a signal processing IC 113 on a second surface which is the opposite side of the first surface; a connection member 120 including wiring of the signal processing IC 113 connected to another substrate (e.g. wiring board 130); and a test terminal 116 connected to the signal processing IC 113 and formed on the first surface of the module substrate 110. 【課題】基板面積が増大することなく、テスト端子を設置できる高周波モジュールを提供する。【解決手段】高周波モジュールは、第１面に送信アンテナ１１１及び受信アンテナ１１２を有し第１面とは反対側の第２面に信号処理ＩＣ１１３を有するモジュール基板１１０と、他の基板（例えば配線基板１３０）に接続される信号処理ＩＣ１１３の配線を含む接続部材１２０と、信号処理ＩＣ１１３と接続されモジュール基板１１０の第１面に設けられるテスト端子１１６と、を備える。【選択図】図１
Bibliography:Application Number: JP20130148774